AT&S (Chongqing) Campus Recruitment in 2022 奥特斯科技(重庆)有限公司2022校园招聘 Company Profile公司简介 AT&S is the European market leaderone of the globally leading manufacturers of high-end IC Substrateshigh-value printed circuit boards. AT&S industrializes leading-edge technologies for its core business segments as Mobile Devices, Automotive, Industrial, MedicalAdvanced IC Packaging. 奥地利科技与系统技术股份公司（AT&S）简称奥特斯，是欧洲以及全球领先的高端半导体封装载板和高密度互连印制电路板制造商。集团致力于生产具有前瞻性技术的产品，并将工业领域的核心市场定位于：移动设备、汽车和航天、工业电子、医疗与健康以及先进半导体封装领域。 As a fast growing multinational company, AT&S currently has six production bases in AustriaAsia – Austria: Leoben (Headquarter)Fehring; Asia: Nanjangud of India, Ansan of Korea, ShanghaiChongqing of China. 作为一家迅速发展的跨国企业，奥特斯目前在奥地利本土和亚洲地区共拥有六个生产基地 - 奥地利：利奥本、菲岭；亚洲：印度南燕古德、韩国安山、中国上海和重庆。 Established in 2011, AT&S Chongqing is located in Chongqing Liangjiang New Area Yufu Industrial Park,this is the second sole proprietorship enterprise of AT&S Group established in China. AT&S is currently investing in two cutting-edge technologies in Chongqing,started mass production in 2016. AT&S Chongqing produces the latest generation of high-end IC Substrates for the use in computer microprocessor,HDI PCB for the use in mobile devices, wearable deviceshigh-end internet products. AT&S Chongqing has become the first high-end IC Substrates manufacturer in China. 奥特斯科技（重庆）有限公司建立于2011年，是奥特斯集团在中国设立的第二家独资企业（工厂位于重庆市两江新区鱼复工业园区）。奥特斯目前在中国重庆工厂投资两大尖端技术，于2016年投产,生产全球领先的半导体封装载板和模组产品，产品应用于电脑微处理器、移动设备、可穿戴设备和高端物联网产品。奥特斯已成为中国首家新一代高端半导体封装载板制造商。 In Jul. 2019, AT&S announced to invest nearly one billion Euro for the next five years to build a new plant in Chongqing, which introduces the most advanced technologyequipment to produce new high-end IC Substrates. The company plans to start production in fiscal year 2021/22. The project adopts the mainstream carrier board technology for current high-performance computing applications,the products are widely used in servers, personal computers, automobiles5G. 2019年奥特斯宣布扩产建设重庆三期项目，引进最先进的技术和设备，生产高端半导体封装载板，计划在2021/22财年启动生产。项目采用了目前高性能计算应用的主流载板技术，产品广泛适用于服务器、个人电脑、汽车和5G等领域。